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Method to predict length dependency of negative bias temperature instability degradation in p-MOSFETs

Jihoon SeoDepartment of Electrical Engineering, Pohang University of Science and Technology, Pohang, Gyeongbuk 790-784, Republic of KoreaGang-Jun KimDepartment of Electrical Engineering, Pohang University of Science and Technology, Pohang, Gyeongbuk 790-784, Republic of KoreaDonghee SonDepartment of Electrical Engineering, Pohang University of Science and Technology, Pohang, Gyeongbuk 790-784, Republic of KoreaNam-Hyun LeeMemory Division, Samsung Electronics, Hwasung, Gyeonggi 445-701, Republic of KoreaY.M. KangMemory Division, Samsung Electronics, Hwasung, Gyeonggi 445-701, Republic of KoreaBongkoo KangDepartment of Electrical Engineering, Pohang University of Science and Technology, Pohang, Gyeongbuk 790-784, Republic of Korea
2016en
ABI

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Abstract We propose a method to predict the length dependency of the magnitude of degradation caused by negative bias temperature instability (NBTI) stress applied to a p-MOSFET. Threshold voltage degradation Δ V th varied according to the drain bias V d , during the measurement of drain current I d . The depletion length L dep into the channel was calculated based on a particular V d value and the channel doping concentration. L dep was used to extract the channel edge region length L edge , then the center channel region length L cen was obtained by subtracting L edge from the gate length L gate . We proposed an equation that uses L dep , L cen , L edge and degree of Δ V th variation to calculate Δ V th according to L gate while the p-MOSFET is under NBTI stress. Equation estimates of Δ V th at different L gate were similar to measurements.

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