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The microencapsulation, thermal enhancement, and applications of medium and high‐melting temperature phase change materials: A review

Rizal SinagaEngineering Management Study Program Institut Teknologi Del Laguboti IndonesiaJo DarkwaFaculty of Engineering; Building, Energy and Environment Research Group University of Nottingham, University Park Nottingham UKSiddig OmerFaculty of Engineering; Building, Energy and Environment Research Group University of Nottingham, University Park Nottingham UKMark WorallFaculty of Engineering; Building, Energy and Environment Research Group University of Nottingham, University Park Nottingham UK

2022en

ABI

Annotatsiya

Microencapsulated phase change materials (MEPCMs) have made tremendous advancements in recent years, owing to their increased demand for a variety of energy storage applications. In this paper, current microencapsulation techniques, enhancement, and use of medium-and high-melting phase change materials (PCMs) are reviewed, as well as their potential benefits and limitations. The most frequently employed PCMs for medium-and high-temperature applications were recognized as salt-based, metallic, inorganic compound, and eutectic. Meanwhile, polymethyl methacrylate (PMMA), polystyrene-butylacrylate (PSBA), polyethyl-2-cyanoacrylate (PECA), and polyurethane were widely used as polymer shell materials for encapsulating medium-and high-melting point PCMs via chemical method, whereas inorganic silica shell was synthesized via various techniques.

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DOI: 10.1002/er.7860

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