Article

Thermal resistance of multicontact packets

T. A. KurskayaPhysicotechnical Institute of Low Temperatures, Academy of Sciences of the Ukrainian SSR, KharkovE. P. LevchenkoPhysicotechnical Institute of Low Temperatures, Academy of Sciences of the Ukrainian SSR, KharkovR. S. Mikhal'chenkoPhysicotechnical Institute of Low Temperatures, Academy of Sciences of the Ukrainian SSR, KharkovA. M. RybalkoPhysicotechnical Institute of Low Temperatures, Academy of Sciences of the Ukrainian SSR, KharkovB. Ya. SukharevskiǐPhysicotechnical Institute of Low Temperatures, Academy of Sciences of the Ukrainian SSR, Kharkov

Journal of Engineering Physics and Thermophysicsjournal1969en

ABI

Abstract

No abstract available.

Topics

3D IC and TSV technologies

Identifiers

DOI: 10.1007/bf00832107

Citations and references

Cited by 1 2 references

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