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3D IC and TSV technologies

8 works

  1. Thermal resistance of multicontact packets

    T. A. Kurskaya, E. P. Levchenko, R. S. Mikhal'chenko +2

    Article3D IC and TSV technologiesJournal of Engineering Physics and Thermophysics19691 citations
    ABI

  2. Influence of Ultrasonic Waves on Current-Voltage Characteristics and Polarization Effects of Si-N-P Radiation Receivers

    Abdumalik Gaibov, Kutbiddin Ilovitddinovich Vakhobov, B.V. Ibragimova +2

    Article3D IC and TSV technologiesMaterials science forum20221 citations
    ABI

  3. Control of Diffusion Bonding Quality

    D. Kotelnikov

    ChapterElectronic Packaging and Soldering Technologies19910 citations
    ABI

  4. Direct Bonding of Silicon Wafers with Grooved Surfaces: Characterization of Defects and Application to High Power Devices

    I. V. Grekhov, T. S. Argunova, M. Yu. Gutkin +2

    Article3D IC and TSV technologiesMaterials science forum19950 citations
    ABI

  5. Direct bonding of silicon wafers with a diffusion layer

    V. B. Voronkov, E. G. Guk, В. А. Козлов +1

    Article3D IC and TSV technologiesTechnical Physics Letters19980 citations
    ABI

  6. Surface Activated Bonding of Glass Using Aluminum Oxide Intermediate Layer for Microchannel Fabrication

    Kai Takeuchi, Fengwen Mu, Yoshiie Matsumoto +2

    ArticleNanofabrication and Lithography TechniquesECS Meeting Abstracts20200 citations
    ABI

  7. New Possibilities for Room Temperature Bonding Technology

    Hibiki OTOMO

    Article3D IC and TSV technologiesJournal of The Surface Finishing Society of Japan20210 citations
    ABI

  8. Design, Preparation and Characterization of Flexible Ultra High Frequency (UHF) Antennas Based on Polyether Ether Ketone (PEEK) Films

    Xuanzheng Zhao, Н. Р. Вохидова, Yinxiang Lu

    ArticleAdvanced Sensor and Energy Harvesting MaterialsJournal of Electronic Materials20220 citations
    ABI