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Article

New Possibilities for Room Temperature Bonding Technology

Hibiki OTOMOLantechnical Service Co., Ltd
Journal of The Surface Finishing Society of Japanjournal2021en
ABI

Abstract

2 Si Fe 2 Si Fe (1) () (2) Si 5 8 nm (3) Si () (4) 1 2 Si (Si ) Si (Si ) (Si ) Si () () Si

Topics

3D IC and TSV technologiesAdditive Manufacturing and 3D Printing TechnologiesManufacturing Process and Optimization

Identifiers

DOI
10.4139/sfj.72.690

Citations and references

Cited by 03 references
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