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Chapter

Control of Diffusion Bonding Quality

D. KotelnikovTcherkassy’s Branch of the Kiev Politechnical Institute, Tcherkassy, Russia
1991fr
ABI

Abstract

No abstract available.

Topics

Electronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis

Identifiers

DOI
10.1007/978-94-011-3674-7_6

Citations and references

Cited by 01 references
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