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Electronic Packaging and Soldering Technologies

16 works

  1. High-Temperature Thermal Conductivity of SAV-1 Aluminum Alloy

    I. Kh. Abdukadyrova, Sh. A. Alikulov, Farkhad Akhmedzhanov +3

    ArticleIntermetallics and Advanced Alloy PropertiesAtomic Energy20142 citations
    ABI

  2. Temperature dependence of the resistance of Cu–Cu point contacts over the temperature range 1.5–100 °K

    A. I. Akimenko, A. B. Verkin, N. M. Ponomarenko +1

    ArticleElectronic Packaging and Soldering TechnologiesSoviet Journal of Low Temperature Physics19810 citations
    ABI

  3. Current-voltage characteristics of bismuth whiskers at helium temperature

    Yu. A. Bogod, Р. Г. Валеев, D. V. Gitsu +1

    ArticleElectronic Packaging and Soldering TechnologiesSoviet Journal of Low Temperature Physics19820 citations
    ABI

  4. Thermoelectric effects and the asymmetry of the current-voltage characteristics of metallic point contacts

    Yu. G. Naĭdyuk, N. N. Gribov, O. I. Shklyarevskiǐ +2

    ArticleSemiconductor materials and interfacesSoviet Journal of Low Temperature Physics19850 citations
    ABI

  5. Thermoelectric effects in metal point contacts in a magnetic field

    É. N. Bogachek

    ArticleIntermetallics and Advanced Alloy PropertiesSoviet Journal of Low Temperature Physics19900 citations
    ABI

  6. Investigations of the low-temperature plasticity anomalies in Pb-Sn alloys by active deformation and creep techniques

    I. A. Shepel’, L. N. Zagoruiko, В. Д. Нацик +2

    ArticleMicrostructure and mechanical propertiesSoviet Journal of Low Temperature Physics19910 citations
    ABI

  7. Control of Diffusion Bonding Quality

    D. Kotelnikov

    ChapterElectronic Packaging and Soldering Technologies19910 citations
    ABI

  8. Direct Bonding of Silicon Wafers with Grooved Surfaces: Characterization of Defects and Application to High Power Devices

    I. V. Grekhov, T. S. Argunova, M. Yu. Gutkin +2

    Article3D IC and TSV technologiesMaterials science forum19950 citations
    ABI

  9. Direct bonding of silicon wafers with a diffusion layer

    V. B. Voronkov, E. G. Guk, В. А. Козлов +1

    Article3D IC and TSV technologiesTechnical Physics Letters19980 citations
    ABI

  10. Morphology, internal structure and growth mechanism of electrodeposited Ni and Co powders

    V.D. Jović, Vesna Maksimović, M.G. Pavlović +1

    ArticleElectrodeposition and Electroless CoatingsJournal of Solid State Electrochemistry20050 citations
    ABI

  11. Structure of vacuum Cu–Ta condensates

    А. И. Зубков, E. N. Zubarev, O. V. Sоbоl +2

    ArticleElectronic Packaging and Soldering TechnologiesThe Physics of Metals and Metallography20170 citations
    ABI

  12. ON BEHAVIOR OF INTERPHASE INTERACTIONS IN SILICON CONTACT STRUCTURES DUE TO QUICK THERMAL TREATMENT

    Akkumis Berisbayevna Ataubayeva

    ArticleAdhesion, Friction, and Surface InteractionsAustrian Journal of Technical and Natural Sciences20220 citations
    ABI

  13. Production of tin-lead solder based on archaeological lead for low-background experiments

    N.T. Temerbulatova, N.A. Mirzayev, D. V. Karaivanov +7

    ArticleElectronic Packaging and Soldering TechnologiesJournal of Instrumentation20250 citations
    ABI

  14. Effect of Elastomer Thickness and Hard Particles in Contact Zone on the Adhesive Contact Between an Elastomer and Flat Elliptical Indenters

    Thao H. Pham, Fabian Forsbach, I. A. Lyashenko

    ChapterAdhesion, Friction, and Surface InteractionsAdvanced structured materials20250 citations
    ABI

  15. Quality control of outsole products using SPC and FTA methods

    S. Sunariyah, Wiwik Sulistyowati, Atikha Sidhi Cahyana +2

    ArticleReliability and Maintenance OptimizationAIP conference proceedings20260 citations
    ABI

  16. Corrosion and hardness properties of SAC305/Cu solder joint by microwave hybrid heating

    Uzair Naeem, Ow Guan Yi, Enis Nadia Md Yusof +5

    ArticleElectronic Packaging and Soldering TechnologiesSoldering and Surface Mount Technology20260 citations
    ABI