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Electronic Packaging and Soldering Technologies

16 ta ish

  1. High-Temperature Thermal Conductivity of SAV-1 Aluminum Alloy

    I. Kh. Abdukadyrova, Sh. A. Alikulov, Farkhad Akhmedzhanov +3

    MaqolaIntermetallics and Advanced Alloy PropertiesAtomic Energy20142 iqtibos
    ABI

  2. Temperature dependence of the resistance of Cu–Cu point contacts over the temperature range 1.5–100 °K

    A. I. Akimenko, A. B. Verkin, N. M. Ponomarenko +1

    MaqolaElectronic Packaging and Soldering TechnologiesSoviet Journal of Low Temperature Physics19810 iqtibos
    ABI

  3. Current-voltage characteristics of bismuth whiskers at helium temperature

    Yu. A. Bogod, Р. Г. Валеев, D. V. Gitsu +1

    MaqolaElectronic Packaging and Soldering TechnologiesSoviet Journal of Low Temperature Physics19820 iqtibos
    ABI

  4. Thermoelectric effects and the asymmetry of the current-voltage characteristics of metallic point contacts

    Yu. G. Naĭdyuk, N. N. Gribov, O. I. Shklyarevskiǐ +2

    MaqolaSemiconductor materials and interfacesSoviet Journal of Low Temperature Physics19850 iqtibos
    ABI

  5. Thermoelectric effects in metal point contacts in a magnetic field

    É. N. Bogachek

    MaqolaIntermetallics and Advanced Alloy PropertiesSoviet Journal of Low Temperature Physics19900 iqtibos
    ABI

  6. Investigations of the low-temperature plasticity anomalies in Pb-Sn alloys by active deformation and creep techniques

    I. A. Shepel’, L. N. Zagoruiko, В. Д. Нацик +2

    MaqolaMicrostructure and mechanical propertiesSoviet Journal of Low Temperature Physics19910 iqtibos
    ABI

  7. Control of Diffusion Bonding Quality

    D. Kotelnikov

    BobElectronic Packaging and Soldering Technologies19910 iqtibos
    ABI

  8. Direct Bonding of Silicon Wafers with Grooved Surfaces: Characterization of Defects and Application to High Power Devices

    I. V. Grekhov, T. S. Argunova, M. Yu. Gutkin +2

    Maqola3D IC and TSV technologiesMaterials science forum19950 iqtibos
    ABI

  9. Direct bonding of silicon wafers with a diffusion layer

    V. B. Voronkov, E. G. Guk, В. А. Козлов +1

    Maqola3D IC and TSV technologiesTechnical Physics Letters19980 iqtibos
    ABI

  10. Morphology, internal structure and growth mechanism of electrodeposited Ni and Co powders

    V.D. Jović, Vesna Maksimović, M.G. Pavlović +1

    MaqolaElectrodeposition and Electroless CoatingsJournal of Solid State Electrochemistry20050 iqtibos
    ABI

  11. Structure of vacuum Cu–Ta condensates

    А. И. Зубков, E. N. Zubarev, O. V. Sоbоl +2

    MaqolaElectronic Packaging and Soldering TechnologiesThe Physics of Metals and Metallography20170 iqtibos
    ABI

  12. ON BEHAVIOR OF INTERPHASE INTERACTIONS IN SILICON CONTACT STRUCTURES DUE TO QUICK THERMAL TREATMENT

    Akkumis Berisbayevna Ataubayeva

    MaqolaAdhesion, Friction, and Surface InteractionsAustrian Journal of Technical and Natural Sciences20220 iqtibos
    ABI

  13. Production of tin-lead solder based on archaeological lead for low-background experiments

    N.T. Temerbulatova, N.A. Mirzayev, D. V. Karaivanov +7

    MaqolaElectronic Packaging and Soldering TechnologiesJournal of Instrumentation20250 iqtibos
    ABI

  14. Effect of Elastomer Thickness and Hard Particles in Contact Zone on the Adhesive Contact Between an Elastomer and Flat Elliptical Indenters

    Thao H. Pham, Fabian Forsbach, I. A. Lyashenko

    BobAdhesion, Friction, and Surface InteractionsAdvanced structured materials20250 iqtibos
    ABI

  15. Quality control of outsole products using SPC and FTA methods

    S. Sunariyah, Wiwik Sulistyowati, Atikha Sidhi Cahyana +2

    MaqolaReliability and Maintenance OptimizationAIP conference proceedings20260 iqtibos
    ABI

  16. Corrosion and hardness properties of SAC305/Cu solder joint by microwave hybrid heating

    Uzair Naeem, Ow Guan Yi, Enis Nadia Md Yusof +5

    MaqolaElectronic Packaging and Soldering TechnologiesSoldering and Surface Mount Technology20260 iqtibos
    ABI