M. Yu. Gutkin

5 ta ish

Russian Academy of Sciences

1. Direct Bonding of Silicon Wafers with Grooved Surfaces: Characterization of Defects and Application to High Power Devices

   I. V. Grekhov, T. S. Argunova, M. Yu. Gutkin +2

   Maqola3D IC and TSV technologiesMaterials science forum19950 iqtibos

   ABIABI:AkademIndex/openalex/1995.article.000102

2. Structural and Electrical Quality of Silicon Bicrystals Fabricated by a Modified Direct Bonding Technique

   T. S. Argunova, M. Yu. Gutkin, L. S. Kostina +3

   MaqolaThin-Film Transistor TechnologiesDiffusion and defect data, solid state data. Part B, Solid state phenomena/Solid state phenomena19990 iqtibos

   ABIABI:AkademIndex/openalex/1999.article.000171

3. X-Ray Imaging and TEM Study of Micropipes Related to their Propagation through Porous SiC Layer/SiC Epilayer Interface

   T. S. Argunova, M. Yu. Gutkin, Jung Ho Je +5

   MaqolaSilicon Carbide Semiconductor TechnologiesMaterials science forum20040 iqtibos

   ABIABI:AkademIndex/openalex/2004.article.000164

4. Structural Transformation of Dislocated Micropipes in Silicon Carbide

   M. Yu. Gutkin, A. G. Sheĭnerman, T. S. Argunova +4

   MaqolaAdvanced Surface Polishing TechniquesMaterials science forum20040 iqtibos

   ABIABI:AkademIndex/openalex/2004.article.000208

5. Dislocation Mechanisms of Misfit Stress Relaxation in Crystalline Nanoheterostructures

   M. Yu. Gutkin, A. L. Kolesnikova, S.A. Krasnitckii +6

   MaqolaMetal and Thin Film MechanicsThe Physics of Metals and Metallography20240 iqtibos

   ABIABI:AkademIndex/openalex/2024.article.003144