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Electronic Packaging and Soldering Technologies

Работ: 16

  1. High-Temperature Thermal Conductivity of SAV-1 Aluminum Alloy

    I. Kh. Abdukadyrova, Sh. A. Alikulov, Farkhad Akhmedzhanov +3

    СтатьяIntermetallics and Advanced Alloy PropertiesAtomic Energy2014Цитирований: 2
    ABI

  2. Temperature dependence of the resistance of Cu–Cu point contacts over the temperature range 1.5–100 °K

    A. I. Akimenko, A. B. Verkin, N. M. Ponomarenko +1

    СтатьяElectronic Packaging and Soldering TechnologiesSoviet Journal of Low Temperature Physics1981Цитирований: 0
    ABI

  3. Current-voltage characteristics of bismuth whiskers at helium temperature

    Yu. A. Bogod, Р. Г. Валеев, D. V. Gitsu +1

    СтатьяElectronic Packaging and Soldering TechnologiesSoviet Journal of Low Temperature Physics1982Цитирований: 0
    ABI

  4. Thermoelectric effects and the asymmetry of the current-voltage characteristics of metallic point contacts

    Yu. G. Naĭdyuk, N. N. Gribov, O. I. Shklyarevskiǐ +2

    СтатьяSemiconductor materials and interfacesSoviet Journal of Low Temperature Physics1985Цитирований: 0
    ABI

  5. Thermoelectric effects in metal point contacts in a magnetic field

    É. N. Bogachek

    СтатьяIntermetallics and Advanced Alloy PropertiesSoviet Journal of Low Temperature Physics1990Цитирований: 0
    ABI

  6. Investigations of the low-temperature plasticity anomalies in Pb-Sn alloys by active deformation and creep techniques

    I. A. Shepel’, L. N. Zagoruiko, В. Д. Нацик +2

    СтатьяMicrostructure and mechanical propertiesSoviet Journal of Low Temperature Physics1991Цитирований: 0
    ABI

  7. Control of Diffusion Bonding Quality

    D. Kotelnikov

    ГлаваElectronic Packaging and Soldering Technologies1991Цитирований: 0
    ABI

  8. Direct Bonding of Silicon Wafers with Grooved Surfaces: Characterization of Defects and Application to High Power Devices

    I. V. Grekhov, T. S. Argunova, M. Yu. Gutkin +2

    Статья3D IC and TSV technologiesMaterials science forum1995Цитирований: 0
    ABI

  9. Direct bonding of silicon wafers with a diffusion layer

    V. B. Voronkov, E. G. Guk, В. А. Козлов +1

    Статья3D IC and TSV technologiesTechnical Physics Letters1998Цитирований: 0
    ABI

  10. Morphology, internal structure and growth mechanism of electrodeposited Ni and Co powders

    V.D. Jović, Vesna Maksimović, M.G. Pavlović +1

    СтатьяElectrodeposition and Electroless CoatingsJournal of Solid State Electrochemistry2005Цитирований: 0
    ABI

  11. Structure of vacuum Cu–Ta condensates

    А. И. Зубков, E. N. Zubarev, O. V. Sоbоl +2

    СтатьяElectronic Packaging and Soldering TechnologiesThe Physics of Metals and Metallography2017Цитирований: 0
    ABI

  12. ON BEHAVIOR OF INTERPHASE INTERACTIONS IN SILICON CONTACT STRUCTURES DUE TO QUICK THERMAL TREATMENT

    Akkumis Berisbayevna Ataubayeva

    СтатьяAdhesion, Friction, and Surface InteractionsAustrian Journal of Technical and Natural Sciences2022Цитирований: 0
    ABI

  13. Production of tin-lead solder based on archaeological lead for low-background experiments

    N.T. Temerbulatova, N.A. Mirzayev, D. V. Karaivanov +7

    СтатьяElectronic Packaging and Soldering TechnologiesJournal of Instrumentation2025Цитирований: 0
    ABI

  14. Effect of Elastomer Thickness and Hard Particles in Contact Zone on the Adhesive Contact Between an Elastomer and Flat Elliptical Indenters

    Thao H. Pham, Fabian Forsbach, I. A. Lyashenko

    ГлаваAdhesion, Friction, and Surface InteractionsAdvanced structured materials2025Цитирований: 0
    ABI

  15. Quality control of outsole products using SPC and FTA methods

    S. Sunariyah, Wiwik Sulistyowati, Atikha Sidhi Cahyana +2

    СтатьяReliability and Maintenance OptimizationAIP conference proceedings2026Цитирований: 0
    ABI

  16. Corrosion and hardness properties of SAC305/Cu solder joint by microwave hybrid heating

    Uzair Naeem, Ow Guan Yi, Enis Nadia Md Yusof +5

    СтатьяElectronic Packaging and Soldering TechnologiesSoldering and Surface Mount Technology2026Цитирований: 0
    ABI