3D IC and TSV technologies

Работ: 8

Thermal resistance of multicontact packets
T. A. Kurskaya, E. P. Levchenko, R. S. Mikhal'chenko +2
Статья3D IC and TSV technologiesJournal of Engineering Physics and Thermophysics1969Цитирований: 1
ABI
Influence of Ultrasonic Waves on Current-Voltage Characteristics and Polarization Effects of Si-N-P Radiation Receivers
Abdumalik Gaibov, Kutbiddin Ilovitddinovich Vakhobov, B.V. Ibragimova +2
Статья3D IC and TSV technologiesMaterials science forum2022Цитирований: 1
ABI
Control of Diffusion Bonding Quality
D. Kotelnikov
ГлаваElectronic Packaging and Soldering Technologies1991Цитирований: 0
ABI
Direct Bonding of Silicon Wafers with Grooved Surfaces: Characterization of Defects and Application to High Power Devices
I. V. Grekhov, T. S. Argunova, M. Yu. Gutkin +2
Статья3D IC and TSV technologiesMaterials science forum1995Цитирований: 0
ABI
Direct bonding of silicon wafers with a diffusion layer
V. B. Voronkov, E. G. Guk, В. А. Козлов +1
Статья3D IC and TSV technologiesTechnical Physics Letters1998Цитирований: 0
ABI
Surface Activated Bonding of Glass Using Aluminum Oxide Intermediate Layer for Microchannel Fabrication
Kai Takeuchi, Fengwen Mu, Yoshiie Matsumoto +2
СтатьяNanofabrication and Lithography TechniquesECS Meeting Abstracts2020Цитирований: 0
ABI
New Possibilities for Room Temperature Bonding Technology
Hibiki OTOMO
Статья3D IC and TSV technologiesJournal of The Surface Finishing Society of Japan2021Цитирований: 0
ABI
Design, Preparation and Characterization of Flexible Ultra High Frequency (UHF) Antennas Based on Polyether Ether Ketone (PEEK) Films
Xuanzheng Zhao, Н. Р. Вохидова, Yinxiang Lu
СтатьяAdvanced Sensor and Energy Harvesting MaterialsJournal of Electronic Materials2022Цитирований: 0
ABI