Асосий контентга ўтиш
AkademIndex

Маҳсулотлар

Ишлаб чиқувчилар учун

AkademBaseЭкотизим учун очиқ API

3D IC and TSV technologies

8 та иш

  1. Thermal resistance of multicontact packets

    T. A. Kurskaya, E. P. Levchenko, R. S. Mikhal'chenko +2

    Мақола3D IC and TSV technologiesJournal of Engineering Physics and Thermophysics19691 иқтибос
    ABI

  2. Influence of Ultrasonic Waves on Current-Voltage Characteristics and Polarization Effects of Si-N-P Radiation Receivers

    Abdumalik Gaibov, Kutbiddin Ilovitddinovich Vakhobov, B.V. Ibragimova +2

    Мақола3D IC and TSV technologiesMaterials science forum20221 иқтибос
    ABI

  3. Control of Diffusion Bonding Quality

    D. Kotelnikov

    БобElectronic Packaging and Soldering Technologies19910 иқтибос
    ABI

  4. Direct Bonding of Silicon Wafers with Grooved Surfaces: Characterization of Defects and Application to High Power Devices

    I. V. Grekhov, T. S. Argunova, M. Yu. Gutkin +2

    Мақола3D IC and TSV technologiesMaterials science forum19950 иқтибос
    ABI

  5. Direct bonding of silicon wafers with a diffusion layer

    V. B. Voronkov, E. G. Guk, В. А. Козлов +1

    Мақола3D IC and TSV technologiesTechnical Physics Letters19980 иқтибос
    ABI

  6. Surface Activated Bonding of Glass Using Aluminum Oxide Intermediate Layer for Microchannel Fabrication

    Kai Takeuchi, Fengwen Mu, Yoshiie Matsumoto +2

    МақолаNanofabrication and Lithography TechniquesECS Meeting Abstracts20200 иқтибос
    ABI

  7. New Possibilities for Room Temperature Bonding Technology

    Hibiki OTOMO

    Мақола3D IC and TSV technologiesJournal of The Surface Finishing Society of Japan20210 иқтибос
    ABI

  8. Design, Preparation and Characterization of Flexible Ultra High Frequency (UHF) Antennas Based on Polyether Ether Ketone (PEEK) Films

    Xuanzheng Zhao, Н. Р. Вохидова, Yinxiang Lu

    МақолаAdvanced Sensor and Energy Harvesting MaterialsJournal of Electronic Materials20220 иқтибос
    ABI