Статья

Quality control of outsole products using SPC and FTA methods

S. SunariyahIndustrial Engineering Study Program, Universitas Muhammadiyah Sidoarjo, Sidoarjo, IndonesiaWiwik SulistyowatiIndustrial Engineering Study Program, Universitas Muhammadiyah Sidoarjo, Sidoarjo, IndonesiaAtikha Sidhi CahyanaIndustrial Engineering Study Program, Universitas Muhammadiyah Sidoarjo, Sidoarjo, IndonesiaTedjo SukmonoIndustrial Engineering Study Program, Universitas Muhammadiyah Sidoarjo, Sidoarjo, IndonesiaTuxtasinova OdinaKokan State Pedagogical Institute, Kokand, Uzbekistan

AIP conference proceedingsjournal2026

ABI

Аннотация

Аннотация отсутствует.

Темы

Reliability and Maintenance Optimization Electronic Packaging and Soldering Technologies Integrated Circuits and Semiconductor Failure Analysis

Идентификаторы

DOI: 10.1063/5.0296157

Цитирования и источники

Цитирований: 0Использованных источников: 4

Показатели — AkademScholar · Скоро