Article

Quality control of outsole products using SPC and FTA methods

S. SunariyahIndustrial Engineering Study Program, Universitas Muhammadiyah Sidoarjo, Sidoarjo, IndonesiaWiwik SulistyowatiIndustrial Engineering Study Program, Universitas Muhammadiyah Sidoarjo, Sidoarjo, IndonesiaAtikha Sidhi CahyanaIndustrial Engineering Study Program, Universitas Muhammadiyah Sidoarjo, Sidoarjo, IndonesiaTedjo SukmonoIndustrial Engineering Study Program, Universitas Muhammadiyah Sidoarjo, Sidoarjo, IndonesiaTuxtasinova OdinaKokan State Pedagogical Institute, Kokand, Uzbekistan

AIP conference proceedingsjournal2026

ABI

Abstract

No abstract available.

Topics

Reliability and Maintenance Optimization Electronic Packaging and Soldering Technologies Integrated Circuits and Semiconductor Failure Analysis

Identifiers

DOI: 10.1063/5.0296157

Citations and references

Cited by 04 references

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