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Effect of grain boundary scattering on the TCR of thin tin films

C. R. PichardYu. F. KomnikPhysicotechnical Institute of Low Temperatures, Academy of Sciences of the Ukrainian SSR, Kharkov, Ukrainian SSRБ. И. БелевцевPhysicotechnical Institute of Low Temperatures, Academy of Sciences of the Ukrainian SSR, Kharkov, Ukrainian SSRA. J. Tosser
Journal of Materials Science Lettersjournal1983en
ABI

Abstract

No abstract available.

Topics

Copper Interconnects and ReliabilityMetal and Thin Film MechanicsSemiconductor materials and devices

Identifiers

DOI
10.1007/bf00726330

Citations and references

Cited by 012 references
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