Works citing this work

2 works

Work: A three-dimensional model for grain boundary resistivity in metal films

1. Electrical properties of fine crystalline and amorphous metal films, obtained by low temperature condensation (Review)

   Yu. F. Komnik

   ArticleCopper Interconnects and ReliabilitySoviet Journal of Low Temperature Physics19820 citations

   ABIABI:AkademIndex/openalex/1982.article.000117

2. Effect of grain boundary scattering on the TCR of thin tin films

   C. R. Pichard, Yu. F. Komnik, Б. И. Белевцев +1

   ArticleCopper Interconnects and ReliabilityJournal of Materials Science Letters19830 citations

   ABIABI:AkademIndex/openalex/1983.article.000029