Journal of Materials Science Letters

Работ: 1

Журнал · ISSN 0261-8028

1. Effect of grain boundary scattering on the TCR of thin tin films

   C. R. Pichard, Yu. F. Komnik, Б. И. Белевцев +1

   СтатьяCopper Interconnects and ReliabilityJournal of Materials Science Letters1983Цитирований: 0

   ABIABI:AkademIndex/openalex/1983.article.000029