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HfO<sub>2</sub>-Based RRAM: Electrode Effects, Ti/HfO<sub>2</sub> Interface, Charge Injection, and Oxygen (O) Defects Diffusion Through Experiment and <italic>Ab Initio</italic> Calculations

Boubacar TraoréFondation Nanosciences aux limites de la Nanoélectronique and the Institut de Microélectronique Electromagnétisme et Photonique, the Laboratoire d’Hyperfréquences et de Caractérisation, and Grenoble, Institut Polytechnique, Grenoble, FranceP. BlaiseLaboratoire d’Électronique des Technologies de l’Information, Commissariat à l’Energie Atomique et aux Energies Alternatives, Minatec Campus, Grenoble, FranceElisa VianelloLaboratoire d’Électronique des Technologies de l’Information, Commissariat à l’Energie Atomique et aux Energies Alternatives, Minatec Campus, Grenoble, FranceL. PerniolaLaboratoire d’Électronique des Technologies de l’Information, Commissariat à l’Energie Atomique et aux Energies Alternatives, Minatec Campus, Grenoble, FranceB. De SalvoLaboratoire d’Électronique des Technologies de l’Information, Commissariat à l’Energie Atomique et aux Energies Alternatives, Minatec Campus, Grenoble, FranceYoshio NishiDepartment of Electrical Engineering, Stanford University, Stanford, CA, USA
2015en
ABI

Аннотация

We investigate in detail the effects of metal electrodes on the switching performance and conductive filament (CF) stability of HfO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> -based RRAM. The current- voltage characteristics of the devices exhibit different electrodedependent RESET profiles which we attempt to clarify. With the insight from the experimental data, we employ first-principles calculations to have a better microscopic understanding of the devices. We study the charge injection, formation of Frenkel pairs, and diffusion of oxygen defects (oxygen vacancies Vo and oxygen interstitials Oi) that are important in the CF creation and stability during the device operation. Since the presence of Ti in RRAM has been associated with the creation of substoichiometric TiOy region at the Ti/HfO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> interface, we also explore different Ti and Hf suboxides to understand the possible composition of that interface. Our calculations suggest that the composition of the interface would be Ti <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O/Hf <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> O <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">3</sub> from thermodynamic perspective. By combining the experimental and calculations results, we show that the concentration of oxygen interstitial (Oi) ions in the oxide after CF formation is larger for RRAM devices with inert electrodes (like Pt) compared with O reactive electrodes (like Ti) which results in degraded device performance. The lower Oi concentration in HfO <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sub> layer with Ti electrodes results in improved CF thermal stability and device variability.

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