Evaluation of the Topographical Surface Changes of Silicon Wafers after Annealing and Plasma Cleaning
Sebastian StachFaculty of Computer Science and Materials Science, Institute of Informatics, Department of Biomedical Computer Systems, University of Silesia, Będzińska 39, 41-205, Sosnowiec, PolandŞtefan ŢăluThe Directorate of Research, Development and Innovation Management (DMCDI), The Technical University of Cluj-Napoca, Constantin Daicoviciu Street, no. 15, 400020, Cluj-Napoca, Cluj county, RomaniaRashid DallaevFaculty of Electrical Engineering and Communication, Physics Department, Brno University of Technology, Technická 8, 616 00, Brno, Czech RepublicAli ArmanVacuum Technology Research Group, ACECR, Sharif University Branch, Tehran, IranDinara SobolaCentral European Institute of Technology, Brno University of Technology, Purkyňova 123, 612 00, Brno, Czech RepublicMarco SalernoMaterials Characterization Facility, Istituto Italiano di Tecnologia, via Morego 30, I-16163, Genoa, Italy
2019en
ABI
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