Работы, цитирующие эту работу

Работ: 3

Работа: The mean free path of electrons in metals

1. Relationship of electrical resistance of polycrystalline tin films to structural characteristics

   Б. И. Белевцев, Yu. F. Komnik, V. E. Kopina +1

   СтатьяCopper Interconnects and ReliabilitySoviet Journal of Low Temperature Physics1980Цитирований: 1

   ABIABI:AkademIndex/openalex/2026.other.603988

2. Electrical properties of fine crystalline and amorphous metal films, obtained by low temperature condensation (Review)

   Yu. F. Komnik

   СтатьяCopper Interconnects and ReliabilitySoviet Journal of Low Temperature Physics1982Цитирований: 0

   ABIABI:AkademIndex/openalex/1982.article.000117

3. Effect of grain boundary scattering on the TCR of thin tin films

   C. R. Pichard, Yu. F. Komnik, Б. И. Белевцев +1

   СтатьяCopper Interconnects and ReliabilityJournal of Materials Science Letters1983Цитирований: 0

   ABIABI:AkademIndex/openalex/1983.article.000029