Работы, цитирующие эту работу

Работ: 2

Работа: A three-dimensional model for grain boundary resistivity in metal films

1. Electrical properties of fine crystalline and amorphous metal films, obtained by low temperature condensation (Review)

   Yu. F. Komnik

   СтатьяCopper Interconnects and ReliabilitySoviet Journal of Low Temperature Physics1982Цитирований: 0

   ABIABI:AkademIndex/openalex/1982.article.000117

2. Effect of grain boundary scattering on the TCR of thin tin films

   C. R. Pichard, Yu. F. Komnik, Б. И. Белевцев +1

   СтатьяCopper Interconnects and ReliabilityJournal of Materials Science Letters1983Цитирований: 0

   ABIABI:AkademIndex/openalex/1983.article.000029