Key engineering materials

26 та иш

Китоб туркуми · ISSN 1013-9826

1. Low-Inductance Packaging Design for SiC Power MOSFET Modules

   Zhao Bo Zhang, Renze Yu, Saeed Jahdi +3

   МақолаSilicon Carbide Semiconductor TechnologiesKey engineering materials20260 иқтибос

   ABIABI:AkademIndex/openalex/2026.article.018298