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Иш: Effects of process parameters and chamber structure on plasma uniformity in a large-area capacitively coupled discharge
Enhancing plasma uniformity in SiH4/NH3 capacitively coupled plasmas via dielectric structure adjustment positioning adjacent to the power electrode
Sen Wang, Quan‐Zhi Zhang, Maksudbek Yusupov +1
МақолаPlasma Diagnostics and ApplicationsJournal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena20250 иқтибосABI