T.V. Kudryavtzeva

1 ta ish

Physico-Technical Institute

1. Structural Quality of Directly Bonded Silicon Wafers with Regularly Grooved Interfaces

   E. D. Kim, S. C. Kim, J. M. Park +4

   Maqola19972 iqtibos

   ABIABI:AkademIndex/2026.other.616007