Manjunath C

1 ta ish

Jain University

1. Enhancing solder joint reliability through CoCrFeNiMo high-entropy alloy reinforcement: Effects of aging on microstructural, electrical, and mechanical properties

   Seif Al Bustanji, Rakhmonjon Akhmadjonov, Mahendrasinh Chauhan +5

   Maqola20260 iqtibos

   ABIABI:AkademIndex/2026.article.039197