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Enhancing solder joint reliability through CoCrFeNiMo high-entropy alloy reinforcement: Effects of aging on microstructural, electrical, and mechanical properties

Seif Al BustanjiRakhmonjon AkhmadjonovNational University of UzbekistanMahendrasinh ChauhanDepartment of Mechanical Engineering, Faculty of Engineering, Gokul Global University, Sidhpur, Gujarat, IndiaRfqa Abdulkareem ShukurDepartment of Architecture Engineering, College of Engineering, Alnoor University, Mosul, 41012, IraqManjunath CDepartment of Mechanical Engineering, School of Engineering and Technology, JAIN (Deemed to be University), Bangalore, Karnataka, IndiaAbinash MahapatroDepartment of Mechanical Engineering, Siksha 'O' Anusandhan (Deemed to be University), Bhubaneswar, Odisha, 751030, IndiaAhmed Mohsen KhdyrDepartment of Refrigeration and Air Conditioning Engineering Technologies, College of Technical Engineering, The Islamic University, Najaf, IraqHarjot Singh GillDepartment of Mechanical Engineering, Chandigarh University, Mohali, Punjab, India

2026en

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ABI

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DOI: 10.1016/j.microrel.2026.116254

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