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Ish: Enhancing solder joint reliability through CoCrFeNiMo high-entropy alloy reinforcement: Effects of aging on microstructural, electrical, and mechanical properties
Correlation-driven machine learning for accelerated reliability assessment of solder joints in electronics
Vahid Samavatian, Mahmud Fotuhi‐Firuzabad, Majid Samavatian +2
MaqolaOchiq kirish20207 iqtibosABI