Fengwen Mu

1 ta ish

Institute of Microelectronics of the Chinese Academy of Sciences

1. Surface Activated Bonding of Glass Using Aluminum Oxide Intermediate Layer for Microchannel Fabrication

   Kai Takeuchi, Fengwen Mu, Yoshiie Matsumoto +2

   MaqolaNanofabrication and Lithography TechniquesECS Meeting Abstracts20200 iqtibos

   ABIABI:AkademIndex/openalex/2020.article.003857