Yinxiang Lu

1 ta ish

Fudan University

1. Dual 3D network epoxy composites for 6G electronic packaging with superior terahertz absorption, through-plane thermal conductivity, and electrical insulation

   Yunbo Guo, Noira R. Vokhidova, Yinxiang Lu

   Maqola20260 iqtibos

   ABIABI:AkademIndex/openalex/2026.article.045444