Ushbu ishga iqtibos qilgan ishlar

2 ta ish

Ish: A three-dimensional model for grain boundary resistivity in metal films

1. Electrical properties of fine crystalline and amorphous metal films, obtained by low temperature condensation (Review)

   Yu. F. Komnik

   MaqolaCopper Interconnects and ReliabilitySoviet Journal of Low Temperature Physics19820 iqtibos

   ABIABI:AkademIndex/openalex/1982.article.000117

2. Effect of grain boundary scattering on the TCR of thin tin films

   C. R. Pichard, Yu. F. Komnik, Б. И. Белевцев +1

   MaqolaCopper Interconnects and ReliabilityJournal of Materials Science Letters19830 iqtibos

   ABIABI:AkademIndex/openalex/1983.article.000029