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Effect of grain boundary scattering on the TCR of thin tin films

C. R. PichardYu. F. KomnikPhysicotechnical Institute of Low Temperatures, Academy of Sciences of the Ukrainian SSR, Kharkov, Ukrainian SSRБ. И. БелевцевPhysicotechnical Institute of Low Temperatures, Academy of Sciences of the Ukrainian SSR, Kharkov, Ukrainian SSRA. J. Tosser

Journal of Materials Science Lettersjournal1983en

ABI

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Mavzular

Copper Interconnects and Reliability Metal and Thin Film Mechanics Semiconductor materials and devices

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DOI: 10.1007/bf00726330

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