Impact of the channel shape, back oxide and gate oxide layers on self-heating in nanoscale JL FINFET
A.E. AtamuratovUrgech State University, Urgench, 220100, UzbekistanB.O. JabbarovaM. M. KhalilloevUrgech State University, Urgench, 220100, UzbekistanAhmed YusupovTashkent University of Information Technologies, Tashkent, 100200, UzbekistanK. SivasankaranVellore Institute of Technology, Vellore, Tamilnadu, IndiaJ.C. ChedjouUniversity of Klagenfurt, Klagenfurt, 9020, Austria
ABI
Abstract
We study the impact of channel shape, back oxide, and gate oxide on the self-heating performance in nanoscale junctionless Fin Field Effect Transistor through numerical simulation. The role of back oxide and gate oxide layers in setting the channel temperature is compared. Simulation results show that in the case of hafnium oxide (HfO 2 ) as the gate oxide and silicon dioxide (SiO 2 ) as the back oxide, the main role in setting the channel temperature corresponds to the base width of the channel that is in contact with the back oxide layer. KEYWORDS self-heating effect,