Chenwei Dai

2 ta ish

Suzhou University of Science and Technology

1. Analysis on ground surface in ultrasonic face grinding of silicon carbide (SiC) ceramic with minor vibration amplitude

   Chenwei Dai, Zhen Yin, Ping Wang +2

   Maqola20212 iqtibos

   ABIABI:AkademIndex/2026.other.146994

2. Material removal mechanism of SiC ceramics by elliptic ultrasonic vibration-assisted grinding (EUVAG) using single grain

   Kun Zhang, Zhen Yin, Chenwei Dai +3

   Maqola20222 iqtibos

   ABIABI:AkademIndex/2026.other.147070