Kun Zhang

1 ta ish

Suzhou University of Science and Technology

1. Material removal mechanism of SiC ceramics by elliptic ultrasonic vibration-assisted grinding (EUVAG) using single grain

   Kun Zhang, Zhen Yin, Chenwei Dai +3

   Maqola20222 iqtibos

   ABIABI:AkademIndex/2026.other.147070