T.V. Kudryavtzeva

1 ta ish

1. Direct Bonding of Silicon Wafers with Grooved Surfaces: Characterization of Defects and Application to High Power Devices

   I. V. Grekhov, T. S. Argunova, M. Yu. Gutkin +2

   Maqola3D IC and TSV technologiesMaterials science forum19950 iqtibos

   ABIABI:AkademIndex/openalex/1995.article.000102