Direct Bonding of Silicon Wafers with Grooved Surfaces: Characterization of Defects and Application to High Power Devices
I. V. GrekhovIoffe Institute of RAST. S. ArgunovaIoffe Physicotechnical Institute RASM. Yu. GutkinRussian Academy of SciencesL. S. KostinaT.V. Kudryavtzeva
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