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3D IC and TSV technologies

8 ta ish

  1. Thermal resistance of multicontact packets

    T. A. Kurskaya, E. P. Levchenko, R. S. Mikhal'chenko +2

    Maqola3D IC and TSV technologiesJournal of Engineering Physics and Thermophysics19691 iqtibos
    ABI

  2. Influence of Ultrasonic Waves on Current-Voltage Characteristics and Polarization Effects of Si-N-P Radiation Receivers

    Abdumalik Gaibov, Kutbiddin Ilovitddinovich Vakhobov, B.V. Ibragimova +2

    Maqola3D IC and TSV technologiesMaterials science forum20221 iqtibos
    ABI

  3. Control of Diffusion Bonding Quality

    D. Kotelnikov

    BobElectronic Packaging and Soldering Technologies19910 iqtibos
    ABI

  4. Direct Bonding of Silicon Wafers with Grooved Surfaces: Characterization of Defects and Application to High Power Devices

    I. V. Grekhov, T. S. Argunova, M. Yu. Gutkin +2

    MaqolaOchiq kirish3D IC and TSV technologiesMaterials science forum19950 iqtibos
    ABI

  5. Direct bonding of silicon wafers with a diffusion layer

    V. B. Voronkov, E. G. Guk, В. А. Козлов +1

    Maqola3D IC and TSV technologiesTechnical Physics Letters19980 iqtibos
    ABI

  6. Surface Activated Bonding of Glass Using Aluminum Oxide Intermediate Layer for Microchannel Fabrication

    Kai Takeuchi, Fengwen Mu, Yoshiie Matsumoto +2

    MaqolaNanofabrication and Lithography TechniquesECS Meeting Abstracts20200 iqtibos
    ABI

  7. New Possibilities for Room Temperature Bonding Technology

    Hibiki OTOMO

    MaqolaOchiq kirish3D IC and TSV technologiesJournal of The Surface Finishing Society of Japan20210 iqtibos
    ABI

  8. Design, Preparation and Characterization of Flexible Ultra High Frequency (UHF) Antennas Based on Polyether Ether Ketone (PEEK) Films

    Xuanzheng Zhao, Н. Р. Вохидова, Yinxiang Lu

    MaqolaAdvanced Sensor and Energy Harvesting MaterialsJournal of Electronic Materials20220 iqtibos
    ABI