E. G. Guk

1 ta ish

Fizika-Texnika Instituti

1. Direct bonding of silicon wafers with a diffusion layer

   V. B. Voronkov, E. G. Guk, В. А. Козлов +1

   Maqola3D IC and TSV technologiesTechnical Physics Letters19980 iqtibos

   ABIABI:AkademIndex/1998.article.000270