Ushbu ishga iqtibos qilgan ishlar

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Ish: Electrical-Resistivity Model for Polycrystalline Films: the Case of Arbitrary Reflection at External Surfaces

1. Relationship of electrical resistance of polycrystalline tin films to structural characteristics

   Б. И. Белевцев, Yu. F. Komnik, V. E. Kopina +1

   MaqolaCopper Interconnects and ReliabilitySoviet Journal of Low Temperature Physics19801 iqtibos

   ABIABI:AkademIndex/openalex/2026.other.603988

2. Electrical properties of fine crystalline and amorphous metal films, obtained by low temperature condensation (Review)

   Yu. F. Komnik

   MaqolaCopper Interconnects and ReliabilitySoviet Journal of Low Temperature Physics19820 iqtibos

   ABIABI:AkademIndex/openalex/1982.article.000117

3. Effect of grain boundary scattering on the TCR of thin tin films

   C. R. Pichard, Yu. F. Komnik, Б. И. Белевцев +1

   MaqolaCopper Interconnects and ReliabilityJournal of Materials Science Letters19830 iqtibos

   ABIABI:AkademIndex/openalex/1983.article.000029