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Ish: Relationship of electrical resistance of polycrystalline tin films to structural characteristics

1. Effect of grain boundary scattering on the TCR of thin tin films

   C. R. Pichard, Yu. F. Komnik, Б. И. Белевцев +1

   MaqolaCopper Interconnects and ReliabilityJournal of Materials Science Letters19830 iqtibos

   ABIABI:AkademIndex/openalex/1983.article.000029