T.V. Kudryavtzeva

Работ: 1

1. Direct Bonding of Silicon Wafers with Grooved Surfaces: Characterization of Defects and Application to High Power Devices

   I. V. Grekhov, T. S. Argunova, M. Yu. Gutkin +2

   Статья3D IC and TSV technologiesMaterials science forum1995Цитирований: 0

   ABIABI:AkademIndex/openalex/1995.article.000102