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Copper Interconnects and Reliability

Работ: 68

  1. Pd-Based Ohmic Contacts to LPE 4H-SiC with Improved Thermal Stability

    L. Kassamakova-Kolaklieva, Roumen Kakanakov, V. Cimalla +4

    СтатьяSilicon Carbide Semiconductor TechnologiesMaterials science forum2003Цитирований: 0
    ABI

  2. Temperature Dependence of Free Volume in Pure and Silica‐Filled Poly(dimethyl siloxane) from Positron Lifetime and PVT Experiments

    G. Dlubek, Udayan De, Jürgen Pionteck +3

    СтатьяMuon and positron interactions and applicationsMacromolecular Chemistry and Physics2005Цитирований: 0
    ABI

  3. Reluctance of the YBa2Cu3Ox oxygen-deficient ceramics

    R.R. Vildanov, B. Yu. Sokolov

    СтатьяPhysics of Superconductivity and MagnetismRussian Physics Journal2007Цитирований: 0
    ABI

  4. Structural characterization and electro-physical properties for SiOC(–H) low-k dielectric films

    A. S. Zakirov, P. K. Khabibullaev, Chi Kyu Choi

    СтатьяCopper Interconnects and ReliabilityPhysica B Condensed Matter2009Цитирований: 0
    ABI

  5. Measurement of efficient thickness of transition layer, stimulated by microwave radiation, in contacts Mo-GaAs

    A. B. Kamalov

    СтатьяSemiconductor materials and interfacesRadioelectronics and Communications Systems2009Цитирований: 0
    ABI

  6. WITHDRAWN: Metal-Insulator Transitions and Stripe Formation in Hole-Doped Cuprates

    S. Dzhumanov, U.T. Kurbanov, Z. S. Khudayberdiev

    СтатьяCopper Interconnects and ReliabilityPhysica C Superconductivity2009Цитирований: 0
    ABI

  7. WITHDRAWN: Intersite bipolarons induced by vibrations of apex ions of cuprates

    Bakhrom Yavidov, S. Dzhumanov

    СтатьяHigh voltage insulation and dielectric phenomenaPhysica C Superconductivity2009Цитирований: 0
    ABI

  8. Structural changes induced by argon ion irradiation in TiN thin films

    M. Popović, M. Novaković, Zlatko Rakočević +1

    СтатьяMetal and Thin Film MechanicsProcessing and Application of Ceramics2011Цитирований: 0
    ABI

  9. Estimation of the sizes of disordered surface regions of Cu and Ag thin films using the ion transmission method

    З. А. Исаханов, Б. Е. Умирзаков, М. К. Рузибаева +2

    СтатьяCopper Interconnects and ReliabilityJournal of Surface Investigation X-ray Synchrotron and Neutron Techniques2013Цитирований: 0
    ABI

  10. Structure and Mechanical Properties of Multilayered Nanostructured TiN/ZrN Ion-plasma Coatings

    Олександр В`ячеславович Бондар, Александр Вячеславович Бондарь, О. В. Бондар +6

    СтатьяMetal and Thin Film MechanicsElectronic Sumy State University Institutional Repository (Sumy State University)2015Цитирований: 0
    ABI

  11. Structure of vacuum Cu–Ta condensates

    А. И. Зубков, E. N. Zubarev, O. V. Sоbоl +2

    СтатьяElectronic Packaging and Soldering TechnologiesThe Physics of Metals and Metallography2017Цитирований: 0
    ABI

  12. Area-selective Ru ALD by amorphous carbon modification using H plasma: from atomistic modeling to full wafer process integration

    Ivan Zyulkov, Е. Н. Воронина, Mikhail Krishtab +6

    СтатьяSemiconductor materials and devicesMaterials Advances2020Цитирований: 0
    ABI

  13. Structure of Aluminum Films for the Creation of Tunnel Junctions

    М. В. Стрелков, A. M. Chekushkin, A. A. Lomov +3

    СтатьяSurface and Thin Film PhenomenaJournal of Communications Technology and Electronics2023Цитирований: 0
    ABI

  14. Dielectric Properties of Zirconium Carbide (ZrC) in the Terahertz Domain: Challenges with Surface Layers

    Muhammad Farooq Saleem, Ghulam Abbas Ashraf, Muhammad Javid +9

    СтатьяSemiconductor materials and devicesJOM2024Цитирований: 0
    ABI

  15. CVC Structure of PtSi - Si<Pt>-M in a Wide Range of Temperatures

    A. T. Mamadalimov, Makhmudkhodja Sh. Isaev, Tokhirjon U. Atamirzaev +2

    СтатьяSemiconductor materials and interfacesEast European Journal of Physics2024Цитирований: 0
    ABI

  16. Enhancing plasma uniformity in SiH4/NH3 capacitively coupled plasmas via dielectric structure adjustment positioning adjacent to the power electrode

    Sen Wang, Quan‐Zhi Zhang, Maksudbek Yusupov +1

    СтатьяPlasma Diagnostics and ApplicationsJournal of Vacuum Science & Technology B Nanotechnology and Microelectronics Materials Processing Measurement and Phenomena2025Цитирований: 0
    ABI

  17. Formation of Cu₁₅Si₄/Si Nanophase Films on Silicon Surfaces

    K. Dovranov, M. Normuradov, X. Davranov +5

    СтатьяSemiconductor materials and interfacesEast European Journal of Physics2026Цитирований: 0
    ABI

  18. Dielectric Performance and Reprocessability of Boronic-Ester Vitrimeric Epoxy with Nanoscale Phase Separation

    Li Zhang, Yiwei Wang, Liang Zou +4

    СтатьяCopper Interconnects and ReliabilityIEEE Transactions on Dielectrics and Electrical Insulation2026Цитирований: 0
    ABI